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Data Port EMI Filter Array with ESD Protection CM1454
Features
* * * * * * * OptiguardTM coated for improved reliability Eight channels of EMI filtering Three C-L-C filters with ESD protection for stereo speaker port Five C-R-C filters with ESD protection for microphone and data ports +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package (CSP) features extremely low parasitic inductance for optimum filter and ESD performance 20 bump, 3.960mm x 1.586mm footprint CSP RoHS compliant (lead-free)
Product Description
The CM1454 is an EMI filter array with ESD protection in a CSP form factor for the data port of a mobile handset. The CM1454-08 is configured in an 8 channel format and combines both resistorcapacitor (R-C) and inductor-capacitor (L-C) filters in the chip. There are five C-R-C filters with component values of 30pF-100 -30pF which are used for the microphone and data ports. There are also three CL-C filters with values of 80pF-3nH-80pF which are designed for the stereo speaker port. The CM1454's C-RC filters have a cut-off frequency of 60MHz and an attenuation of better than 35dB over the 800MHz to 2.7GHz frequency range. The C-L-C filters have a cut-off frequency of 21MHz with an attenuation of 40dB at 1Ghz. The parts integrate ESD protection diodes on every pin that provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, which is beyond the Level 4 requirement of the IEC61000-4-2 international standard. In accordance with MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are also protected for contact discharges at greater than 30kV. The CM1454 incorporates OptiGuardTM which results in improved reliability at assembly. The CM1454 is available in a space saving, low profile Chip Scale Package with, RoHS compliant, lead-free finishing.
* *
Applications
* * * * * Combination I/O data port that has I/Os for data, microphone and speaker I/O port protection for mobile handsets, notebook computers, PDAs etc "EMI filtering for data ports in cell phones, PDAs or notebook computers Wireless Handsets Handheld PCs / PDAs
(c)2010 SCILLC. All rights reserved. April 2010 Rev. 2
Publication Order Number: CM1454/D
CM1454
Electrical Schematic
Figure 1. CM1454 Schematic Diagram of R-C and L-C Filter Arrays with ESD
Rev. 2 | Page 2 of 10 | www.onsemi.com
CM1454
PIN DESCRIPTIONS
PIN NUMBER PIN DESCRIPTION Filter #1 (Microphone) Filter #2 (Microphone) Filter #3 (Stereo Headphone) Filter #4 (Left Speaker) Filter #5 (Right Speaker) Filter #6 (Accessory ID) Filter #7 (Data) Filter #8(Data) GND GND PIN NUMBER PIN DESCRIPTION GND GND Filter #1 Filter #2 Filter #3 Filter #4 Filter #5 Filter #6 Filter #7 Filter #8
A1 A2 A3 A4 A5 A6 A7 A8 B1 B2
B3 B4 C1 C2 C3 C4 C5 C6 C7 C8
Rev. 2 | Page 3 of 10 | www.onsemi.com
CM1454
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish Bumps 20 Package CSP Ordering Part Number CM1454-08CP
1
Part Marking N548
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC current per Inductor DC Package Power Rating RATING -65 to +150 30 0.5 UNITS C mA W
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
Rev. 2 | Page 4 of 10 | www.onsemi.com
CM1454
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL R C1 L RE C2 PARAMETER Resistance Capacitance Inductance Equivalent Series Resistance of Inductor Capacitance 0V dc; 1MHz, 30mV ac; 100 2.5V dc; 1MHz, 30mV ac CONDITIONS MIN 80 24 TYP 100 30 3.0 0.25 125 150 MAX 120 36 UNITS pF nH pF
2.5V dc; 1MHz, 30mV ac;
64
80
96
pF
fRC
Cut-off frequency ZSOURCE = 50, ZLOAD = 50 Cut-off frequency ZSOURCE = 50, ZLOAD = 50 Stand-off Voltage Diode Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative I = 10A VIN = 3.3V
60
MHz
fLC
21
MHz
VST ILEAK VSIG
6.0 0.1 1.0
V A
ILOAD = 10mA ILOAD = -10mA Notes 2 and 3
5.6 -1.5
6.8 -0.8
9.0 -0.4
V V
VESD
30 15 2.3 0.9
kV kV
RDYN
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open.
Rev. 2 | Page 5 of 10 | www.onsemi.com
CM1454
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 2. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8
Figure 3. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5
Rev. 2 | Page 6 of 10 | www.onsemi.com
CM1454
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 4. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
Rev. 2 | Page 7 of 10 | www.onsemi.com
CM1454
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 8 of 10 | www.onsemi.com
CM1454
Mechanical Specifications
CM1454 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf.
PACKAGE DIMENSIONS
Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 20 Inches
3.915 3.960 4.005 0.1541 0.1559 0.1577 1.541 1.586 1.631 0.0607 0.0624 0.0642 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.308 0.358 0.408 0.0121 0.0141 0.0161 0.574 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
Package Dimensions for CM1454-08CP Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
Rev. 2 | Page 9 of 10 | www.onsemi.com
CM1454
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 4.06 X 1.98 X 0.76 TAPE WIDTH W 12mm REEL DIAMETER 330mm (13") QTY PER REEL 3500
PART NUMBER CM1454-08CP
CHIP SIZE (mm) 3.96 X 1.586X 0.640
P0 4mm
P1 4mm
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+
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ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Rev. 2 | Page 10 of 10 | www.onsemi.com

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